8" - 3M™ 3792LMQ Low-Melt Glue SticksLow melt is applied at 265 F. to bond heat sensitive substrates such as polystyrene foam. 40 second bonding range when dispensed at low melt temperature. Bonds wood, corrugated, polyolefins and other light weight materials. FDA listed.
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product description
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Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. 40 second bonding range when dispensed at low-melt temperature.
Bonds wood, corrugated, polyolefins and other light-weight materials.
FDA listed.